Packing of electronic device components

Depending on the weight and shape of distributed parts, we offer the best packing shape design.

Celpet and Neo-Microlen foam sheets have many advantageous features suitable for streamlining and upgrading of distribution of electronic device components. We support our customers with our coherent system from material development to design and delivery.

Assembly packing for small-sized HDD (Neo-Microlen)

Neo-Microlen, our foamed polypropylene sheet product, offers superior impact resistance and wearing resistance compared to non-foamed sheets, and protects electronic components from impact and wear. It also excels in heat resistance under high temperature and high moisture.

Tray for small-sized LCD module (Neo-Microlen Z)

Neo Microlen Z is the sustained antistatic grade of Neo-Microlen, our foamed polypropylene sheet product. Its antistatic ability does not deteriorate much even after washing, and for that reason suited as shuttle distribution tray. In addition, a stable anti-static performance can be obtained under a low moisture environment in winter.

Assembly shock-absorbing packing for PC LCD cell (CELPET F)

This material uses Celpet F, whose main raw material is recycled PET bottles. Operation efficiency can be upgraded thanks to the light weight, softness, and high shock-absorbing performance of Celpet F.